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LNP™ THERMOCOMP™ Compound UX06032

LNP* THERMOCOMP* UX06032 is a compound based on Polyphthalamide resin containing Glass Fiber, Flame Retardant. Added features of this material include: Flame Retardant, Non-Bromin...

LNP™ THERMOCOMP™ Compound 2C003

LNP THERMOCOMP 2C003 is a compound based on ETFE resin containing 15% Carbon Fiber. Added features of this material include: Electrically Conductive.

LNP™ THERMOCOMP™ Compound 2C004

LNP THERMOCOMP 2C004 is a compound based on ETFE resin containing 20% Carbon Fiber. Added features of this material include: Electrically Conductive.

LNP™ THERMOCOMP™ Compound 2X04505

LNP THERMOCOMP 2X04505 is a compound based on ETFE resin containing Proprietary Filler(s).

LNP™ THERMOCOMP™ Compound 2X95787

LNP THERMOCOMP 2X95787 is a compound based on ETFE Copolymer resin containing Proprietary Filler(s).

LNP™ THERMOCOMP™ Compound PCAF04FRHH

LNP* THERMOCOMP* PCA04FRHH is a 20 % glass reinforced PC+ABS blend without chlorinated or brominated flame retardants. LNP* THERMOCOMP* complies with the material requirements as s...

LNP™ THERMOCOMP™ AM Compound AC004XXAR1

LNP™ THERMOCOMP™ AM, grade name AC004XXAR1, is a compound based on ABS resin containing 20% carbon fiber for Large Format Additive manufacturing (LFAM) applications needing higher ...

LNP™ THERMOCOMP™ AM Compound AF004XXAR1

LNP™ THERMOCOMP™ AM, grade name AF004XXAR1, is a compound based on ABS resin containing 20% glass fiber for Large Format Additive Manufacturing (LFAM) applications. ABS based comp...

LNP™ THERMOCOMP™ AM Compound DC0041XA51

LNP THERMOCOMP DC0041XA51 compound is based on PC Copolymer Resin containing 20% carbon fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this gr...

LNP™ THERMOCOMP™ AM Compound DC004XXAR1

LNP™ THERMOCOMP™ AM, grade name DC004XXAR1, is a compound based on PC resin containing 20% carbon fiber for Large Format Additive manufacturing (LFAM) applications needing higher s...